Toughened, Two Component, Epoxy for Bonding and Sealing

Master Bond® Supreme 11HTLP is a high performance, higher viscosity, two part epoxy for bonding and sealing. It is exceptionally easy to use with a one to one mix ratio by weight or volume. Supreme 11HTLP has a convenient working life and cures readily at room temperature or more quickly at elevated temperatures. The optimum curing schedule is overnight at room temperature, followed by 2-3 hours at 150-200 ºF. Supreme 11HTLP is formulated to have imposing toughness, which in turn imparts high bond strengths in both the shear and peel mode. It also allows the system to resist demanding thermal cycling as well as impact and shock. Supreme 11HTLP bonds well to a wide variety of substrates, including metals, glass, ceramics, composites, many rubbers and plastics. It has good chemical resistance to water, oil and fuels. Upon curing, it is a dependable electrical insulator. Most significant is its very wide temperature range of -100 ºF to +400 ºF. Moreover, Supreme 11HTLP has low shrinkage upon curing, reliable dimensional stability and is readily machinable. The color of Part A is gray and Part B is amber. The very user friendly processing and top notch performance profile enables Supreme 11HTLP to be used in a wide variety of high-tech applications, especially in aerospace, electronics, specialty OEM and related industries.