Two Component, Epoxy Compound for High Performance Applications

$0.00

SKU: master-bond-inc-57716013077.1181.1106 Category:

Master Bond® EP21NDFG is a two component, room temperature curing epoxy adhesive/sealant featuring outstanding physical properties, easy processing and a non-drip, paste-like consistency. This system has a non-critical one to one mix ratio by weight or volume. EP21NDFG has the unusual characteristic of being able to adjust the properties of the cured system by altering the mix ratio. Adding more of Part A (e.g. 2:1 mix ratio) will give a more rigid cure, while adding more of Part B (e.g. 1:2 mix ratio) gives a more forgiving cure. EP21NDFG produces high strength, durable bonds which hold up well to thermal cycling and resist many chemicals including water, oils, fuels, acids, bases and salts. It bonds well to a variety of substrates including metals, composites, glass, ceramics and many types of rubbers and plastics. Once cured, EP21NDFG is an excellent electrical insulator. It is serviceable over the wide temperature range of -60 ºF to +250 ºF. The color of both Parts A and Part B is amber, although, a wide variety of additional color choices are also available. EP21NDFG is primarily used in food equipment applications where there is an indirect exposure to food and related products.

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