One Component, Epoxy System for Bonding, Sealing, Coating, and Casting

Master Bond® EP17HT-LO is an extraordinary one component, heat cured epoxy system for bonding, sealing, coating and encapsulating. It features excellent physical properties, a superb electrical insulation profile and chemical resistance even with heat exposure to 650 ºF. Its glass transition temperature (T_g) is 225 ºC. This system is also distinctive in that it has very low exotherm upon curing and can be used in castings and encapsulations well beyond 1/2 inch in thickness. The minimum curing temperature for EP17HT-LO is 300 ºF with faster cures attainable at higher temperatures. Please refer to the curing section for additional details.

EP17HT-LO is 100 % reactive and contains no solvents or diluents. EP17HT-LO bonds well to similar as well as dissimilar substrates such as metal, ceramics, plastics and composites. It resists many chemicals such as acids, bases, salts, fuels, oils and many solvents. Shrinkage upon cure is minimal. It is serviceable from -80 ºF to +650 ºF. This system is tan in color. EP17HT-LO retains its exceptional electrical insulation properties, even at higher temperatures. It should be noted, in order to obtain the optimum properties, a post cure of 2-12 hours at 350 ºF is recommended. As mentioned above, EP17HT-LO meets NASA low outgassing specifications. It is widely used in a variety of applications in the aerospace, oil and chemical processing, optical, optoelectronic and specialty OEM industries.