One Component, High Temperature Resistant Epoxy System for Bonding, Sealing, and Coating with a Paste Consistency

Master Bond® EP17HTND-2 is a special one component, heat cured epoxy system for bonding, sealing and coating. It requires no mixing and needs to be cured at 300-350 ºF. Typical curing schedules are 6-8 hours at 300 ºF or 4-5 hours at 350 ºF. The optimum cure schedule would be one of the schedules mentioned above followed by 6-12 hours at 350 ºF. Curing in this manner will result in a glass transition temperature (Tg) of 230-240 ºC. EP17HTND-2 is a paste formulation with minimal flow while curing.

This epoxy system features excellent physical properties and a superb electrical insulation profile even at elevated temperatures. This system is also distinctive in that it has very low exotherm upon curing. EP17HTND-2 is 100% reactive and contains no solvents or diluents. EP17HTND-2 bonds well to similar and dissimilar substrates such as metal, ceramics, plastics and composites. It has a noteworthy resistance to many chemicals including acids, bases, salts, fuels, oils and many solvents, even at elevated temperatures. It has minimal shrinkage upon curing. Its service temperature range is from -80 ºF to +650 ºF. This epoxy is black. Since it passes NASA low outgassing, it can be used in vacuum type situations and other applications where that requirement is needed. EP17HTND-2 can be used in a number of applications involving aerospace, oil and chemical processing, specialty OEM as well as other industries where this very unique set of properties is required.