One Component, Epoxy System for Potting, Encapsulation, Bonding, and Sealing Applications with a Curing Temperature of 200 to 220ºF or Higher

Master Bond® EP17HT-100 is a high performance, one part epoxy that combines easy handling with superb physical properties. The use of this epoxy is straightforward and simple. EP17HT-100 is not premixed and frozen and has unlimited working life at room temperature. It has a moderate viscosity with good flow properties, and can be used for potting and encapsulation in thicknesses up to 1/2 inch. Most importantly, EP17HT-100 cures in 60-90 minutes at 200-220ºF, or 45-60 minutes at 275-300ºF. Optimal properties are achieved with curing at 3-4 hours at 300ºF followed by post curing at 350-400ºF for a few hours, if possible. And, although the best properties are obtained by going with the higher temperature curing, the 200-220ºF schedule still gives very good physical strength values along with first rate thermal conduction and electrical insulation numbers as well. It bonds well to metals, composites, ceramics, glass and many plastics. EP17HT-100 has superior chemical resistance to oils, fuels, acids, bases, water and many solvents. The service temperature range is -100ºF to +500ºF. EP17HT-100 is naturally yellow-tan, but other colors are available. Storing at 40-50ºF is more than sufficient and freezing is not required nor recommended. EP17HT-100 is an excellent choice in aerospace, electronic, optical and other high-tech applications, where the blend of a non-mix system, a lower heat curing schedule and robust properties, especially temperature resistance, is desirable.