Two Component, Highly Flexibilized Epoxy Resin Compound

Master Bond® EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding, sealing, coating and encapsulation. It has a forgiving one to three mix ratio by weight. The system is formulated to cure fully at ambient temperature or more quickly at elevated temperatures. The optimum cure schedule is overnight at room temperature followed by 2-3 hours at 150-200 ºF. An unusual feature here is that the curing cycle can affect the hardness of the system. If cured only at elevated temperatures, the Shore A hardness is 50-55. If cured with the optimum cure schedule, the Shore A is 75-80. It has very high peel strength and elongation. EP21TDC-2 develops very little exotherm while curing, making it well suited for sealing or encapsulating in thicker sections. It has excellent adhesion to a wide array of substrates including metals, composites, glass, ceramics and many rubbers and plastics. Its superior flexibility allows EP21TDC-2 to have excellent thermal cycling properties along with exceptional resistance to thermal and mechanical shock and vibration. This epoxy is a superb electrical and thermal insulator with good resistance to chemicals such as water, oils, hydraulic fluids, bases and salts. EP21TDC-2 is cryogenically serviceable and has a temperature range of 4K to +250 ºF. EP21TDC-2 is widely used in aerospace, specialty OEM, optical and especially in applications where robust thermal cycling properties and shock resistance are paramount.