Two Component, Optically Clear, Nanosilica Filled Epoxies for Potting, Encapsulating, Coating, and Sealing

Master Bond® EP114 is a two component, nanosilica filled epoxy system for potting, coating and sealing. The addition of the nano particles enhances the dimensional stability and the already exceptionally low shrinkage upon curing. EP114 has a 100 to 80 mix ratio by weight. It has an unusually low viscosity along with an especially long open time of 2-4 days. It should be noted that EP114 requires oven curing. A typical cure schedule is 2-3 hours at 250ºF followed by 5-8 hours at 300ºF with a 2 hour or longer post cure at 350ºF, although, a number of variations are possible.

EP114 is a top tier electrical insulator. It bonds well to a wide variety of substrates including metals, composites, glass, ceramics and plastics. As a toughened system, it has good resistance to thermal cycling and shock. When the aforementioned properties are combined with its pronounced low viscosity, it is a highly attractive candidate for potting and encapsulating. Some other positive features include its excellent physical strength profile as well as its chemical resistance to water, oils, acids, bases and fuels. The service temperature range is -100ºF to +550ºF. EP114 is a versatile, specialty type system that can be used in many different aerospace, electronic and OEM applications where this uncommon blend of product properties is desirable.