Two Component, Room Temperature Curing Epoxy Compound featuring an Ultra Low Coefficient of Thermal Expansion

Master Bond® EP42HT-2LTE is an innovative, two component epoxy system with an ultra low coefficient of thermal expansion. It can be used as an adhesive, sealant, coating and, in some cases, as a casting system. EP42HT-2LTE has a forgiving 100 to 40 mix ratio by weight, or a 100 to 50 mix ratio by volume. After mixing, the consistency is that of a paste with some flow. It will cure at room temperature in 4-7 days or more quickly at elevated temperatures, e.g. 4-6 hours at 150-200 ºF. However, to optimize properties, the recommended cure is overnight at room temperature followed by 3-5 hours at 150-200 ºF. The mainstay property of this epoxy system is its exceptionally low coefficient of expansion of 9-12 x 10-6 in/in/ºC. It has an array of other highly desirable properties including stellar electrical insulation, very good chemical resistance and unsurpassed dimensional stability. This epoxy will bond well to a wide variety of substrates, including metals, composites, ceramics, glass and many plastics. It is also noteworthy for its low linear(<0.01%) and volumetric(<0.1%) shrinkage. The latter property is particularly useful in potting and encapsulation applications. Also, the compound allows for precise alignment with minimal fixturing and simple curing. Its service temperature range is from 4K to +300 ºF. The color of Part A is light cream and Part B is similar, but slightly darker. EP42HT-2LTE and its very special property profile allows it to be a desirable selection for the more challenging electronic, aerospace, optical, cryogenic and specialty OEM applications. EP42HT-2LTE passes NASA low outgassing tests and is recommended for applications involving vacuums, optics and other usages that require this important property.