Two Component, Room Temperature Curing Epoxy for Bonding, Sealing, Coating, and Encapsulating with Low Coefficient of Thermal Expansion

Master Bond® EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE). It has a forgiving 100 to 5 mix ratio by weight and cures readily at room temperature or more quickly at elevated temperatures. To obtain optimum properties, a good cure schedule is overnight at room temperature followed by 2-4 hours at 150-200ºF. The CTE is extremely low, 10-13 x 10-6 in/in/ºC. Additionally, it is highly dimensionally stable and electrically insulative. Very significantly, this epoxy has low linear and volumetric shrinkage upon curing.

EP30LTE-2 bonds well to a wide variety of substrates including metals, glass, ceramics and many rubbers and plastics. It is 100% reactive and does not contain any solvents or diluents. This system offers excellent resistance to many chemicals, such as water, fuels and oils, as well as a number of acids and bases. It is serviceable over the wide temperature range of -100ºF to +250ºF. Part A of this system is off-white in color and Part B is clear. EP30LTE-2 is especially used in aerospace, optical, electronic, specialty OEM and other applications where low shrinkage, an ultra low CTE along with superb dimensional stability are important requirements.