Two Component, Room Temperature Curing Epoxy for Bonding, Sealing, Coating and Encapsulation featuring High Temperature Resistance

Master Bond® EP33CLV is a two part, room temperature curing epoxy system used for bonding, sealing, coating and encapsulation featuring high temperature resistance. Its processing is certainly user friendly, starting with a forgiving 100 to 70 mix ratio by weight or a one to one ratio by volume. EP33CLV cures readily at room temperature in 2-3 days. Alternatively, at 150-200 ºF, it will cure in 2-3 hours. To optimize its properties, the recommended cure schedule is overnight at room temperature followed by a post cure at 150-200 ºF for 2-3 hours. Its relatively longer open time is also an added benefit for convenient processing.

Upon curing, EP33CLV has an excellent performance profile, as noted in the table below. EP33CLV bonds well to a wide variety of substrates including metals, glass, composites, ceramics as well as many rubbers and plastics. It resists a range of chemicals including water, oils, fuels as well as many acids, bases and solvents. It is a very good electrically insulating system and can be used for small to moderate sized encapsulation applications. It is 100% reactive and does not contain any solvents or diluents. The service temperature range is from -60 ºF to +450 ºF. The color of Part A is light amber, Part B is amber. It is a useful product for electronic, electrical, aerospace and specialty OEM type applications where easy handling, high temperature resistance and better physical properties are desirable.