Two Part, Room Temperature Curing, Thermally Conductive Silicone with Ultra Fine Particle Filler for Bonding and Smaller Gap Filling

Master Bond® MasterSil 151TC is a two component silicone for use primarily in thermal management applications. It is primarily used for bonding or smaller gap filling. It has very fine particles of a thermally conductive filler that allows it to be applied in sections as thin as 10-15 microns. It has a 100 to 4 mix ratio by weight, and upon mixing, flows evenly and smoothly. It will cure in 2-3 hours at 150-200ºF or in 2-3 days at room temperature. The optimum cure is overnight at room temperature followed by 1-2 hours at 150-200ºF.

MasterSil 151TC is an addition cured silicone offering both flexibility and high temperature resistance. Its inherent flexibility allows it to withstand severe thermal cycling as well as vibration and shock. Regarding its thermal transfer capabilities, the system combines high conductivity with very fine particle filler. This allow it to be applied in a very thin layer and lowers its thermal resistance to 7-10 x 10-6 K.m²/W. This is much better than more standard thermally conductive silicones. The service temperature range is -65ºF to +400ºF. The color of Part A is white and Part B is clear. MasterSil 151TC fits well in applications involving sensitive optical and electronic components where optimum heat dissipation is critical. The other main attributes are its flexibility and its ability to withstand high temperatures, as noted previously.