Two Component, Silver Conductive Epoxy for High Performance Bonding and Sealing

Master Bond® EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. To optimize its properties, the recommended cure schedule is overnight at room temperature followed by a heat cure of 2-3 hours at 200ºF. It has first class electrical conductivity, impressive flexibility and exceptionally good flow. Some other desirable attributes are a one to one mix ratio, by weight and a longer open time. It is a fine adhesive with excellent shear and peel strength. It is 100% reactive and has very low linear shrinkage. It bonds to many substrates, including composites, metals, glass, ceramics, rubbers and plastics. The system’s robust flexibility enables it to withstand severe thermal cycling as well as intense thermal and mechanical shocks. Also, EP21TDCSFL will put very little mechanical stress on sensitive components and substrates. It has reasonably good chemical resistance to water, oils and fuels. Parts A and B are both colored silver. It is serviceable over the wide temperature range of 4K to +250ºF. A very attractive feature of this epoxy is its ability to easily seal and fill gaps up to 1/8 inch thick. Master Bond® EP21TDCSFL adhesive is widely used in the electronic, electrical, semiconductor, electro-optic, aerospace and specialty OEM applications. For convenient handling, EP21TDCSFL is also available in premixed and frozen syringes.