Two Component, Room Temperature Curing Epoxy with Excellent Thermal Transfer Properties

Master Bond® Polymer System EP30AN-1 is a two part epoxy for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity, excellent electrical insulation properties and NASA low outgassing approval. It will cure at room temperature or more rapidly at elevated temperatures. Other attractive properties include superb dimensional stability and superior physical strength properties. Its low viscosity and excellent flow characteristics make it an ideal thermally conductive potting epoxy. EP30AN-1 is also an excellent adhesive/sealant forming durable, rigid bonds that resist to thermal cycling and chemicals including water, oils, etc. over the wide temperature range of -60ºF to 250ºF. The coefficient of thermal expansion is desirably low. The color of part A is gray and part B is clear. Master Bond® EP30AN-1 is widely used in applications where thermal conductivity, electrical isolation and low outgassing properties are required. It is particularly well suited to high vacuum environments.